特性：

    本机适用于各种鞋面无车缝热贴合、4D鞋面贴合

• 系统控制方式：可视化电脑版人机界面+PLC操作系统
  
• 温度控制：特有12路温度监测温控模板，加热控制更***稳定。温度异常报警功能，避免误操作
  
• 新增温度异常检测模块功能：避免温度未达到或超高温疏忽造成操作失误，提升品质减少不良率
  
• 温度检测系统：2路双工位模温产品测量系统，控温达不到所设温度不开模，采用数字化控制，可视化看到每个产品达到***效果
  

Characteristics:

    This machine is suitable for various types of shoe upper seamless thermal bonding, 4D shoe upper bonding

• System control mode: visual computer version human-machine interface+PLC operating system
  
• Temperature control: With a unique 12 channel temperature monitoring temperature control template, heating control is more precise and stable. Temperature abnormal alarm function to avoid misoperation
  
• New temperature anomaly detection module function: to avoid operating errors caused by temperature not reaching or excessive high temperature negligence, improve quality, and reduce defect rate
  
• Temperature detection system: 2-way dual station mold temperature product measurement system. If the temperature cannot reach the set temperature, the mold will not be opened. Digital control is used to visually see that each product achieves the best effect